发明名称 |
Apparatus and method for inspecting soldered portions |
摘要 |
An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
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申请公布号 |
US4772125(A) |
申请公布日期 |
1988.09.20 |
申请号 |
US19860875974 |
申请日期 |
1986.06.19 |
申请人 |
HITACHI, LTD. |
发明人 |
YOSHIMURA, KAZUSHI;HIROI, TAKASHI;NINOMIYA, TAKANORI;HAMADA, TOSHIMITSU;NAKAGAWA, YASUO;KARASAKI, KOHICHI |
分类号 |
G01B11/24;G01N21/64;G01N21/88;G01N21/956;G06T7/00;(IPC1-7):G01N21/64 |
主分类号 |
G01B11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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