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发明名称
Bonding with epoxy resin adhesives in two or more curing rates
摘要
申请公布号
US3385744(A)
申请公布日期
1968.05.28
申请号
US19670648137
申请日期
1967.06.22
申请人
THE BUDD COMPANY
发明人
II HERBERT D. VAN SCIVER
分类号
C09J5/00;C08G59/18
主分类号
C09J5/00
代理机构
代理人
主权项
地址
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