| 摘要 |
PURPOSE:To obtain the title composition excellent in soldering resistance, by mixing a thermosetting resin with a curing agent and a specified compound. CONSTITUTION:100pts.wt. thermosetting resin (A) (e.g., cresol novolac resin of an epoxy equivalent <=500) is mixed with 0.5-1.5 chemical equivalent, per equivalent of component A, of a curing agent (B) (e.g., phenol novolac resin), 0.01-80pts.wt. compound (C) having at least three hydroxyl groups in vicinal positions in the benzene ring (and having a substituent, other than OH, free of a 7C or higher alkyl chain), selected from among pyrogallol, gallic acid and an ester of gallic acid with a 6C or lower alcohol and, optionally, 0.1-20pts. wt. curing catalyst (e.g., 2-methylimidazole), a filler (e.g., fused silica), an elastomer (e.g., silicone rubber), a coupling agent, a mold release, a flame retardant, etc., and the obtained mixture is melt-kneaded at 50-150 deg.C.
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