发明名称 CORRECT METHOD FOR BEND OF PRINTED CIRCUIT BOARD
摘要 PURPOSE:To correct continuously a bend of a printed circuit board in a short period of time, by heating and cooling the printed circuit board having a bend while pressurizing the same between metallic belts. CONSTITUTION:A printed circuit board having a bend is pressurized between metallic belts provided with a heating part and cooling part. Heating temperature is 140-170 deg.C, cooling temperature is a normal temperature -50 deg.C and pressure is 1-50 kg/cm<2>. As heating/cooling is performed while pressurizing, correction of the bend can be performed in a short period of time and the correction process can be incorporated into a continuous process.
申请公布号 JPS63224923(A) 申请公布日期 1988.09.20
申请号 JP19870058775 申请日期 1987.03.16
申请人 SUMITOMO BAKELITE CO LTD 发明人 TANAKA YASUNORI
分类号 B29C53/18;H05K3/00;H05K3/22 主分类号 B29C53/18
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