| 摘要 |
PURPOSE:To make possible the surface packaging of a semiconductor device in a state that the device is positioned to a mother board by a method wherein protruding parts are protruded. on the surface of a substrate in the surface, where terminal parts connected electrically with a semiconductor chip are exposed, of the device. CONSTITUTION:In the case of the production of a semiconductor device A to be used as a pin grid array, pins 5, 5... are each made to expose their base ends on the other one side surface of a substrate 2 as terminal parts 3, 3... and are made to protrude their base ends from the substrate 2 in a slight dimension. Moreover, in the surface, whereon the terminal parts 3 are provided, of the device, a plurality of protruding parts 4, 4... for positioning are made to protrude from the surface of the substrate 2 in the same height and are formed integrally with the substrate 2. The protruding parts 4 are formed in a dimension higher than the protruding height of these terminal parts 3. Moreover, guide holes 33 are recessed in the surface of a mother board 28 in such a way as to correspond to the protruding parts 4 at the positions for mounting the device A and the protruding parts 4 are inserted in these guide boles 33. Thereby, each terminal part 3 of the device A is aligned to the land of each circuit 23 of the mother board 28 and the terminal parts 3 are reliably connected to the circuits 23.
|
