| 摘要 |
PURPOSE:To impart sufficient heat resistance to the title film, by forming a thin film of polyimide resin, etc., on a base material consisting of a polyethylene terephthalate resin, drying the film, and then baking the film while keeping the base material unslacked and flat. CONSTITUTION:The thin film of one or >=two kinds selected from polyimide resin, polyamide-imide resin, polyparabanic acid resin, and polyhydantoin resin or the thin film of a soln. of one or >=two kinds of the above-mentioned resins and one or >=two kinds selected from phenolic resin, epoxy resin, and melamine resin is formed on the base material consisting of polyethylene terephthalate resin. The thin film is dried, and then baked at 200-300 deg.C while keeping the base material unslacked and flat. As a result, a thin film exhibiting sufficient heat resistance and flame resistance and further having excellent softness can be obtained, and the adhesion between the coating layer and the base material and resistance to solvents and shrinkage are remarkably improved.
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