| 摘要 |
PURPOSE:To prevent short-circuit defects due to difference in size of a semiconductor chip and each die pad of a lead frame, by fixing the semiconductor chip fo the lead frame through an insulating supporting plate in a sealing package. CONSTITUTION:A heat resisting insulating film 14 comprising a semiconductor chip incorporating a memory IC is mounted on the tip parts of inner leads 10 of a lead frame 12. Bonding pads 16 on the chip 13 and the inner leads 10 are interconnected with bonding wires 15. The entire body other than a part of outer leads 11 is sealed in a resin package 1. Thus short-circuit defects due to the difference in size of the chip 13 and the die pads of the lead frame 12 are prevented. |
