Photoresist pattern shaping process

摘要

A photoresist pattern shaping process comprises a first exposure of the pattern onto a photoresist layer on the surface of a substrate, insolubilisation of the exposed photoresist layer, a second exposure at least of the unexposed areas of the photoresist layer using light with a wavelength at which the development solubility of the upper section of the photoresist layer is greater than that of the lower section of the photoresist layer, and formation of the resist pattern by development processing.