| 摘要 |
PURPOSE:To obtain the resin excellent in heat, water and weathering resistances, low in water absorptivity and useful as an LSI sealing material, having two specified partial structures. CONSTITUTION:A mixture is obtained by mixing 1-100% 4-vinylcyclohexene-1- oxide (a) with 99-0% another compound (b) having one epoxy compound. This mixture in an amount of 2-100mol. is reacted with 1mol. of an active hydrogen compound (c) such as an alcohol, a phenol, a carboxylic acid, an amine or a thiol at -20-200 deg.C in the presence of a catalyst to obtain a polyether compound (A) having a basic structure of formula I. Component A is epoxidized with an oxidizing agent (B) such as a per acid (e.g., peracetic acid) or a hydroperoxide (e.g., hydrogen peroxide) to obtain the title resin containing partial structures of formulas I and II at a formula III to formula IV ratio of 1.0-4.0 (in terms of a ratio of the functional groups).
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