| 摘要 |
PURPOSE:To reduce the noise of an output signal and to improve the sensitivity and the yield in the manufacture of a solid-state image sensor by hermetically sealing a solid state image sensor chip in a first cavity, and sealing a chip for a peripheral circuit in a second cavity independent from the first cavity. CONSTITUTION:A solid-state image sensor chip 2 is disposed in a first cavity 1A, and hermetically sealed with a glass cap 6. A chip 3 for a peripheral circuit has a driver for driving the chip 2, and is connected through bonding wires 8 and wiring conductors to leads 5 and the chip 2. The chip 3 provided in a second cavity 1B, and chips 4A-4D for the peripheral circuit are hermetically sealed with resin sealing material 7. The cavity 18 formed independently from the cavity 1A is sealed with the chips 3, 4A-4D with the material 7 to reduce the area in the cavity 1A, thereby decreasing the probability of hermetically sealing contaminant for interrupting a light in the cavity 1A and improving the yield of manufacturing it by reducing the occurrence of a malfunction.
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