发明名称 |
CIRCUIT BOARD MADE FROM CROSS-LINKED POLYCYANURATE POLYMER, THERMOPLASTIC POLYMER AND POLYARAMID FIBER |
摘要 |
<p>The present invention is a circuit board having a substrate comprising a semi-IPN and at least one balanced polyaramid layer.</p> |
申请公布号 |
CA1242033(A) |
申请公布日期 |
1988.09.13 |
申请号 |
CA19860499961 |
申请日期 |
1986.01.21 |
申请人 |
ALLIED-SIGNAL INC., |
发明人 |
HSIUE, ERIC S.;ZIATYK, DANIEL;STONE, GEORGE R.;DEBONA, BRUCE T. |
分类号 |
B32B15/08;B32B15/088;B32B27/02;C08J5/04;H05K1/03;(IPC1-7):H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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