| 摘要 |
PURPOSE:To improve the heat resisting property against a solder and the electric insulating resistance of the titled composition by incorporating a specific urethane(meth)acrylate modified polybutadiene resin and a photosensitive compd. capable of generating a strong acid by irradiating a light or an ionizing radiation in the titled composition. CONSTITUTION:Said urethane(meth)acrylate modified polybutadiene resin contains 1,2-unsatd. binding in >=50% of a butadiene unit contd. in a polymer chain, and has 500-5,000 of number average mol.wt., and contains an acryloyl group or a methacryloyl group which binds to the both terminal groups of polybutadiene diol through an urethane binding. The titled composition contains said resin and the photosensitive compd. capable of generating the strong acid by irradiating the light or the ionizing radiation. As the skeletal part of said resin does not decompose, the inherent characteristics of said resin is held, and the heat resisting property against the solder and the electric insulating resistance of the titled composition are improved. |
