| 摘要 |
PURPOSE:To reduce excess products and to prevent products in stock and a stockroom from increasing by a method wherein, when a wafer containing wiring patterns of more than two types of semiconductor integrated circuits is to be tested electrically, desired semiconductor integrated circuits are tested electrically by identifying different types of identification codes on the semiconductor integrated circuits. CONSTITUTION:When semiconductor integrated circuits A are to be tested electrically, they are tested electrically after an identification code 2 situated inside a semiconductor integrated circuit 3 has been identified. That is to say, it is possible to test the semiconductor integrated circuits A on a wafer 1 in the order of arrows 21-24 in succession. This example refers to a case where two different types of semiconductor integrated circuits A and B are to be tested electrically; when more than three types of semiconductor integrated circuits A, B, C,... are contained, they can be tested electrically in the same manner. As the identification code, an electrical method by using an open state and a short-circuited state between identification pads as well as a resistance value and another method to identify an identification mark optically are available. By this setup, it is possible to reduce excess products and to prevent products in stock and a stockroom from increasing. |
