| 摘要 |
PCT No. PCT/JP85/00339 Sec. 371 Date Feb. 17, 1987 Sec. 102(e) Date Feb. 17, 1987 PCT Filed Jun. 17, 1985 PCT Pub. No. WO86/07652 PCT Pub. Date Dec. 31, 1986.A process for manufacturing semiconductor devices according to the present invention comprises a step for thermally oxidizing semiconductor substrates (1), (12), to form first and second oxide films (24), (25) on one main surface and on another main surface thereof, respectively; a step for selectively implanting impurity inons via said first oxide film (24) to form elements in said semiconductor substrates (1), (12); a step for successively forming a film (30) that constitutes a source of impurity diffusion and a protective film (31) on said second oxide film (25); and a step of common heat-treatment for forming predetermined diffused layers (17), (18) on said one main surface of said semiconductor substrates (1), (12) by diffusing at least one kind of the impurity ions that are implanted, and for forming a diffused layer on said another main surface of the semiconductor substrates (1), (12) by diffusing impurities contained in the film (30) that constitutes said source of impurity diffusion into said semiconductor substrates (1), (12) via said second oxide film (25). This makes it possible to effectively remove impurity atoms such as heavy metals present in the semiconductor substrate (1) and to perform the gettering of very fine defects. Further, the protective film (31) prevents adverse effects caused by the heat-treatment that is effected for forming diffused layers (17), (18). Therefore, a semiconductor device having improved reliability can be produced. Moreover, the manufacturing steps can be simplified, and various impurities can be used to form elements, presenting great convenience from the standpoint of production.
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