| 摘要 |
PURPOSE:To form a copper-oxide film having high adhesive strength, by cleaning the surface of copper, oxidizing the above copper with chlorine-dioxide water, and then treating the above with a dilute acid aqueous solution. CONSTITUTION:The surface of Cu is subjected to pretreatment such as degreasing, polishing, etching, pickling, etc., and then immersed into chlorine- dioxide water of 0.1-8.0g/l concentration for 1-30min to undergo oxidation treatment. The above Cu is washed with water and is successively immersed into a 1-5pH dilute acid aqueous solution of mineral acid such as HCl, H2SO4, HNO3, H3PO4, etc., or organic acid such as formic acid, etc., for 5-60min, followed by water washing and drying. In this way, the oxide film of CuO can be formed on the Cu surface with superior adhesive strength to Cu. |
