| 摘要 |
PURPOSE:To realize the high-speed transmission of a signal and the high-density mounting of an LSI by a method wherein a power-supply circuit is formed by connecting a ViA for power supply use and another ViA for power supply use of a printed-circuit board. CONSTITUTION:If a ViA 123-1 of an exclusive substrate 120 and another ViA 113-1 of a printed-circuit board 110 are coupled by using a solder bump 151, a signal-transmitting circuit from a signal layer 111 via a pattern 122 for modification use to a connecting pad 121 for signal use is formed by the ViA 123-1 and wiring parts 124-1, 124-2. If a ViA 123-3 of the exclusive substrate 120 and a ViA 113-2 of the printed-circuit board 110 are coupled, a power-supply circuit is formed between a power-supply circuit is formed between a power- supply layer 112 and the connecting pad 121 for power supply use. Accordingly, at the signal-transmitting circuit the wiring parts 124-1, 124-2 are connected in series and become one wire with respect to the connecting pad 121; a terminating resistor 140 is mounted on the rear. By this setup, the high-density mounting and wiring are realized.
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