| 摘要 |
PURPOSE:To prevent welding to a semiconductor element of a flexible substrate, and to inject a sealing resin easily by projecting the lower surface of a semiconductor element loading section in the flexible substrate with a small sealing hole toward the rear from the surface oppositely faced to the semiconductor element. CONSTITUTION:A sealing hole 2a is bored previously to the lower surface of a loading section for a semiconductor element 1', and the lower surface of the loading section for the semiconductor element 1 is sucked, avoiding the sealing hole 2a so as to projected toward the rear from the surface oppositely faced to the semiconductor element 1 of a flexible substrate 2 by a suction jig 4. The semiconductor element 1 positions solder bumps 1a and a copper foil pattern for the flexible substrate 2, and is heated from the upper surface of the semiconductor element 1. Since the flexible substrate 2 is sucked so as to be protruded from the rear, it is not welded to the semiconductor element 1. The semiconductor device is filled with a liquefied epoxy group sealing resin from the sealing hole 2a. The sealing resin is injected easily into a clearance d' between the lower surface of the semiconductor element 1 and the surface of the flexible substrate 2, and the sealing hole 2a may also be scaled down, thus also keeping a bonded surface largely.
|
