| 摘要 |
A channelized jackfield assembly comprising a housing having an input portion wherein electrical jack modules are insertably disposed for forming a linear array of laterally spaced modules. Each of the modules has a slab-like body disposed with a narrow side uppermost and a thickness defining an aligned feedthrough channel wherein a printed circuit board is disposed on edge. The printed circuit board has a connector with a plurality of contact members disposed for insertable engagement with respective terminals extended from the adjacent end portion of the aligned module. The contact members of the connector are electrically connected through the printed circuit board to respective terminal conductors extended from an edge portion of the board and outwardly of the output portion of the housing. The printed circuit board may be slidably inserted into the output portion of the housing and between opposing wafer guides having in adjacent surfaces thereof respective linear arrays of laterally spaced channels. Also, each of the printed circuit boards may be provided with a pair of outwardly flared latching arms which engage respective lips adjacent the output portion of the housing for removably securing the slidably inserted board in the housing.
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