| 摘要 |
PURPOSE:To reduce the diameter of the insertion part of an endoscope by forming at least a part of the front end constituting part with a transparent member and burying a solid image device (SID) chip in this part. CONSTITUTION:An SID chip 9 arranged on an SID substrate of a first front end constituting part 1 by die bonding is buried in a second front end constituting part 2, which is formed by packing a light-transmissive transparent resin, between a third front end constituting part 3 and the first front end constituting part 1 so that the image pickup surface of the front of the chip 9 faces as objective optical system 4. The SID chip 9 buried in this manner is connected to an electric circuit board 12 arranged on the rear face of the first front end constituting part 1 through the first front end constituting part 1 consisting of the SID substrate by a bonding wire 11 consisting of platinum, gold, or the like. Since it is unnecessary to package and attach SID chips individually, the diameter of the front end part of an endoscope is narrowed.
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