| 摘要 |
PURPOSE:To eliminate the adverse effect on photodetectors at the time of the wiring to the pad parts of common electrodes and its post-treatment and to simplify a packaging work by a method wherein the pad parts are formed at a distance on the side opposite to the electrodes pinching the photodetectors between the pad parts and the common electrodes. CONSTITUTION:Photodetectors 2 on a substrate 1 are connected to each common electrode 3 6 pieces by 6 pieces on one side of the arrangement of the photodetectors 2. Pad parts 3a of then electrodes 3 are formed at a great distance from the photodetectors 2 on the side opposite to the electrodes 3. Leads 3b cross straight the photodetectors 2, individual electrodes 4 and the central part of a matrix wiring part 5 from the electrodes 3 and the electrodes 3 are connected to the pad parts 3a through the leads 3b. Moreover, for avoiding an interference with the leads 3b, cut-off parts 6c of a film wiring plate 6 are formed being divided the component of their 6 pieces into two. Thereby, there is no adverse effect due to the soldering of the pad parts 3a and wire-bonding and packaging work is simplified. |
