| 摘要 |
PURPOSE:To obtain a powdery adhesive, having a component with a constant average particle diameter, substantially spherical shape, ethylenic double bonds in particles, hot melt and thermosetting properties and suitable as point bonding elements of liquid crystal elements. CONSTITUTION:The aimed hot melt and thermosetting type powdery adhesive having at least a component with 0.5-500mum (preferably 1-50mum) average particle diameter (preferably within 30% coefficient of variation of the particle diameter) in substantially spherical shape having ethylenic double bonds in particles (preferably polyfunctional maleimide, unsaturated polyester or polyfunctional oligoacrylate). Furthermore, the unsaturated polyester and polyfunctional oligoacrylate are preferably bisphenol based substances and the component having ethylenic double bonds is preferably an epoxy resin (preferably bisphenol based epoxy resin). The aimed adhesive is used for bonding or sealing glass, metal and electronic materials.
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