| 摘要 |
PURPOSE:To improve the mechanical bending properties while decreasing the failure percentage of semiconductor element by a method wherein a metallized layer is provided on a semiconductor module substrate or the module itself is composed of a metallic material. CONSTITUTION:A metal plated metallized layer 8 is provided on the surface of a semiconductor module substrate 6; or the metallized layer 8 is provided on the rear of a semiconductor element 14; or a semiconductor module substrate itself is composed of a metallic substrate 20 in high bending strength. In such a constitution, when an IC card or a thin semiconductor module is subjected to any bending stress, the bending deformation is relieved so that any mechanical stress imposed on the semiconductor element 14 may be reduced to improve the mechanical reliability of thin semiconductor module.
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