| 摘要 |
PURPOSE:To remove excess soft solder among external terminals and to prevent short circuits among them, by dipping the external terminals of electronic parts into molten solder through the slits of a nonmetallic plate and by drawing the external terminals through the slits after a specified period. CONSTITUTION:The external terminals 3 of an electronic part 1 are dipped into molten solder 4 in a molten solder tank 5 through the slits 6 (or holes) of a heat-resisting nonmetallic plate 2 ('Teflon(R)', etc.), and, after a specified period, the external terminals 3 are drawn through the slits 6. In this way, the molten solder 4 abnormally adhering among the external terminals 3 is removed by means of the slits 6, and short circuits among the external terminals 3 can be prevented.
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