| 摘要 |
PURPOSE:To prevent the lowering of the fixing strength of a stem base by forming a cutting section at an edge in the periphery of the stem base to which a solder material is arranged. CONSTITUTION:Cutting sections 1a are shaped at edges, where a solder material is positioned, in a stem base 1 to which an adjusting-knob 3 is mounted, and a chip 2 is bonded with the stem base 1. The stem base 1 is inserted to a cover 4, the optical axes of the chip 2 and a spherical lens 5 are conformed by moving the adjusting-knob 3, the solder material 6 is melted through heating, and the stem base 1 is fixed to the cover 4. Consequently, even when the stem base 1 is brought into contact with the inner wall of the cover 4, the solder material 6 flows into the cutting sections 1a, thus ensuring the wettability of the solder material 6 in a section corresponding to the inflow of the sodler material. Accordingly, the lowering of the fixing strength of the stem base 1 can be inhibited. |
