| 摘要 |
PURPOSE:To uniformly form an rugged plated layer having superior adhesion on a body to be plated, by periodically reversing the positive and negative polarities of a pair of copper electrodes in an electrolytic circuit formed separately from an electrolytic circuit for rugged copper plating. CONSTITUTION:A copper sulfate plating soln. 9 contg. Cl<-> at a low concn. and a polyoxyethylene surfactant is used for plating. The surfactant forms a complex of C<+> and the Cl<-> contributes toward forming a moderately uneven plated copper layer. When an insoluble anode 18 is used for plating with the plating soln. 9, a large amt. of O2 is generated from the surface of the anode by the electrolysis of water to oxidize Cu<+> to Cu<2+> and the concn. of Cu<+> becomes insufficient. In order to increase the concn. of Cu<+>, electrolysis is carried out with a second electrolytic circuit 28 provided with a pair of copper electrodes 32 and formed separately from a first electrolytic circuit for rugged copper plating in the plating soln. 9. Thus, an rugged plated layer 6 of high quality is obtd. |
