| 摘要 |
PURPOSE:To improve the solderability of an external electrode by forming a Cu layer and an Ag layer as conductor films by vacuum deposition on a background metallic film by means of sputtering in this order so as to eliminate the disconnection of an open lead electrode of an electronic component unit. CONSTITUTION:Insulating plates 20, 40 formed with a notch and an electronic component unit 30 are laminated, and the Cu layer 502 and the Ag layer 503 are formed by vacuum deposition on the background metallic film 501 formed incorporatedly by the sputtering to a wall face in the broadwise direction of notches 21, 22, 41 of the insulators 20, 40 and a lead electrode 31 of the electronic component unit 30. Thus, even if the ground metallic film 501 formed by the sputtering is unstable, the stable conductor film comprising the Cu layer and an Ag layer is formed on the surface and the film thickness of the lead electrode 31 of the electronic component unit 30 is increased. Thus, the open wire caused due to lost Ag at a high temperature is prevented, and the solderability with the conductor film is excellent and uniform solder film is bonded.
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