| 摘要 |
PURPOSE:To obtain the title prepreg freed of intercircuit voids and blur of the terminal of a product, excellent in storage stability and capable of multistage and multilayer molding, by drying bases impregnated with a specified varnish. CONSTITUTION:A varnish is obtained by mixing 100pts.wt. epoxy resin with 1-3pts.wt. dicyandiamide, 1-6pts.wt. (alkyl)phenol novolak resin of a free monomer content >=0.5% of the formula [wherein R is H or CmH2m+1 (wherein m is 1-9), and the average degree of polymerization (degree of polymerization = n+1) of 3-10] and 0.05-0.2pt.wt. imidazole (e.g., 2-ethyl-4-methylimidazole) as a curing catalyst and dissolving the mixture in an organic solvent (e.g., methyl Cellosolve). Bases such as cloth, mat, paper or the like of glass fiber, quartz fiber or the like are impregnated with this varnish and dried to bring the resin to B-stage.
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