| 摘要 |
PURPOSE:To control temperature of semiconductor wafer and obtain desired thermal expansion and contraction by supporting a temperature control apparatus by the base of wafer mounting board and by providing a thermal conductive member having a degree of freedom for movement of wafer mounting board and modification capability between them. CONSTITUTION:A vacuum adsorbing cavity 19 for adsorbing semiconductor wafer 11 and a temperature sensor 23 is provided to a semiconductor wafer mounting board 12. Seven cylindrical protrusions 29 are integrated to the bottom of mounting board 12. A temperature control apparatus providing a cavity part 14, an inlet tube 15 and an exhausting tube 16 is supported by a base 20 through an heat insulating material 18. The seven cylindrical recessed parts are formed at the top of temperature control apparatus 17 corresponding to said cylindrical protrudions 29 and a gap is assured between them in such a degree as not preventing movement of the mounting board 12. A liquid having a high thermal conductivity is injected between the cylindrical recessed part 13 and cylindrical protrusions 29. For such liquid, mercury, 30% aqueous solution of ethylenegricol or thermal conductive silicon oil are recommended. |
