| 摘要 |
PURPOSE:To make a lead frame unified, at the same time eliminating complexity in the case of assembling a semiconductor device, and obtain a highly reliable semiconductor device, by fixing a specified die pad tape equipped with semiconductor pallets on the point ends of the specified leads through a glued layer. CONSTITUTION:The required number of leads out of the leads 2 forming a lead frame where die pads are removed protrude towards a die pad cavity part and the protruded point ends 14 are constructed at an area that is broader than that of other leads. Being composed of a heat resisting backing 10 and of the glued layer 12 by which the backing 10 is fixed to the leads 2, and having an area that is large enough to cover the points of the leads 2 of the lead frame, a die pad tape is equipped with semiconductor pellets 4 and seals the pallets 4. For example, the die pad tape is made by coating with super heat resisting polyimide resin as the glued layer 12 on one side of the backing 10 that is composed of a polyimide resin film and it is cut to a desired size and then it is glued to the lead frame after heating with the glued layer 12 and after that a semiconductor device is assembled by gluing the pellets 4.
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