| 摘要 |
PURPOSE:To decrease the weight of cooling bodies and at the same time improve head transfer characteristics by mounting a plurality of through holes to cooling fins of the cooling bodies. CONSTITUTION:A power semiconductor stack laminated alternately by power semiconductor element 1 and cooling bodies 2 allow a plurality of cooling fins 3 of the cooling bodies to have a plurality of through holes 9 and to be joined thermally to a radical shaft 4 of the cooling bodies 2. Further, the above mentioned cooling fins 3 are curved periodically, for example, in the form of a trapezoidal wave along the flowing direction of a fluid. This approach improves heat transfer characteristics of the cooling fins and makes the weight of the cooling bodies light.
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