发明名称 LIGHT MACHINING METHOD
摘要 PURPOSE:To form plural opening grooves with good efficiency on the body to be worked without damaging a lower layer by projecting plural times on the face to be worked by condensing a light after varying the beam shape of a pulse laser beam in specific wavelength in rectangular shape. CONSTITUTION:The initial light beam 20 in rectangular shape of the pulse laser beam <=400 nm wavelength emitted from an eximer laser 1 is enlarged by a beam expander 2. The light beam 21 enlarged in rectangular shape is passed through a slit 3 and reduced until the spherical aberration of a condensing lens is disregardable. The beam 22 in small width thus formed is condensed by a bar like cylindrical lens 4. The slit like beam 23 in specific width thus obtd. is projected on the surface of the body 11 to be worked on a substrate 10. This laser beam 23 has the beam strength of 0.85-1.5 J/cm<2> on the working face and preferrably is projected in 2-5 times. Said substrate 10 is moved via a Y table 25 to form plural opening grooves optionally on the body 11 to be worked of the non-monocrystal semiconductor, etc., of one part of a photoelectric conversion device.
申请公布号 JPS63215390(A) 申请公布日期 1988.09.07
申请号 JP19870049342 申请日期 1987.03.04
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 SHINOHARA HISATO
分类号 B23K26/00;H01L31/04;H01L31/042;H01S3/101 主分类号 B23K26/00
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