发明名称 RESIST PATTERN FORMING METHOD
摘要 PURPOSE:To enable development immediately after exposure without carrying out a stage for removing a CEL film and to increase the stability when a resist pattern is formed, by using a photosensitive layer contg. a specified compd. CONSTITUTION:A resist layer is selectively exposed through a photosensitive layer for increasing the contrast of light incident on the resist layer, and the resist layer is developed together with the photosensitive layer to form a resist pattern. At this time, a photosensitive layer contg. 7,8,13,14-tetrahydroabietic acid or hydrogenated rosin contg. the acid as the principal component by >=50% is used. Since 7,8,13,14-tetrahydroabietic acid selected as a CEL film forming material among nonpolar org. materials and materials soluble in an aq. alkali soln. is dissolved in an ordinary developer for a positive type resist, the photosensitive layer is removed during development. Rosin increases its stability by hydrogenation and the stability as a soln. in a nonpolar solvent is increased.
申请公布号 JPS63214742(A) 申请公布日期 1988.09.07
申请号 JP19870047806 申请日期 1987.03.04
申请人 OKI ELECTRIC IND CO LTD;FUJI YAKUHIN KOGYO KK 发明人 UMIBE KATSUAKI;KOSUGE MAKI;YAMASHITA YOSHIO;ASANO TAKATERU;KOBAYASHI KENJI
分类号 H01L21/027;G03C1/00;G03F7/00;G03F7/004;G03F7/09;G03F7/095;G03F7/26;G03F7/32;H01L21/30 主分类号 H01L21/027
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