发明名称 |
METHOD OF STANDARDIZATION AND STABILIZATION OF SEMICONDUCTOR WAFERS |
摘要 |
<p>Disclosed is a method of stabilizing and standardizing semiconductor wafers obtained from a plurality of vendor sources for use in both unipolar and bipolar device manufacturing lines. Based on measured initial oxygen concentration, the as-received wafers are grouped into lots. Next, based on measured oxygen precipitation rate of each lot, the wafer lots are grouped into classes, regardless of their vendor origin. Typically, the grouping consists of three classes corresponding to low, intermediate and high oxgen precipitation rate. The wafers of each class are then subjected to a thermal adaptation cycle tailored to the class to generate in each wafer clusters of a concentration corresponding to a predetermined cluster concentration range and a defect-free zone corresponding to a predetermined defect-free zone range. The thermal adaptation cycle is different from class to class, but identical for wafers of a given class.</p> |
申请公布号 |
EP0165364(B1) |
申请公布日期 |
1988.09.07 |
申请号 |
EP19840430020 |
申请日期 |
1984.06.20 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;COMPAGNIE IBM FRANCE |
发明人 |
CAZCARRA, VICTOR;LEROUEILLE, JOCELYNE |
分类号 |
H01L21/322;(IPC1-7):H01L21/66;B07C5/344;C30B33/00;H01L21/324 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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