| 摘要 |
<p>A film releasing agent to be used for releasing an adhesive film (or sheet) adhered to an adherent, which is prepared by compounding 100 parts by weight of a resin composed of 5 to 80 wt % of a thermoplastic resin having a solubility parameter of 8 to 11 and 95 to 20 wt % of a solvent having a solubility parameter of 8 to 11 and a boiling point of 40 to 250°C.</p> |
