METHOD FOR REMOVING PROTUBERANCES AT THE SURFACE OF A SEMICONDUCTOR WAFER USING A CHEM-MECH POLISHING TECHNIQUE,申请号EP19860110462-传众专利搜索

发明名称	METHOD FOR REMOVING PROTUBERANCES AT THE SURFACE OF A SEMICONDUCTOR WAFER USING A CHEM-MECH POLISHING TECHNIQUE
摘要
申请公布号	EP0224646(A3)	申请公布日期	1988.09.07
申请号	EP19860110462	申请日期	1986.07.29
申请人	INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	BEYER, KLAUS DIETRICH;MAKRIS, JAMES STEVE;MENDEL, ERIC;NUMMY, KAREN ANN;OGURA, SEIKI;RISEMAN, JACOB;ROVEDO, NIVO
分类号	H01L21/76;H01L21/302;H01L21/306;H01L21/3065;H01L21/3105;H01L21/74;H01L21/762;H01L21/763;(IPC1-7):H01L21/306	主分类号	H01L21/76
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