发明名称 HIGH-SPEED PLATING METHOD AND APPARATUS
摘要 PURPOSE:To control curling and waving and to enable precise partial plating by high-speed continuous treatment, by drawing a coiled work, twisting it from a horizontal state to a vertical state, accurately setting plating positions during travelling and carrying out high-speed plating. CONSTITUTION:This high-speed plating apparatus is composed essentially of an uncoiler 31 for drawing a work W, a power supply unit 33, guide rollers 34 for positioning the work W, a plating unit 36 and a work driving unit 38 for holding and travelling the work W. The beltlike long-sized work W is twisted to a vertical state by twisting rollers 32, electric current is supplied to the work W and the work W is pretreated with pretreating and preplating units and plated. The placed work W is held between the soft elastic endless belts of the unit 38 and travelled under tension.
申请公布号 JPS63213693(A) 申请公布日期 1988.09.06
申请号 JP19870047363 申请日期 1987.03.02
申请人 SONITSUKUSU:KK 发明人 SHIMAZU YASUO
分类号 C25D5/02;B65H5/06;B65H20/02;B65H20/06;B65H27/00;C25D7/06 主分类号 C25D5/02
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