| 摘要 |
A desoldering method and apparatus for removal of molten solder from joined parts including a desoldering tool; a vacuum pump connected to the desoldering tool for applying vacuum thereto for removing the solder; a motor for energizing the pump; and circuitry for providing an initial, relatively high, voltage to the motor and for thereafter providing a relatively lower voltage to the motor so that, during the application of the high voltage to the motor, a relatively large pulse of the vacuum is applied to the joined parts to (a) effect removal of substantially all of the molten solder into the desoldering tool and (b) initiate cooldown of the parts and, during the application of the lower voltage to the motor, a relatively lower vacuum is continuously applied to maintain the cooldown of the parts.
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