| 摘要 |
PURPOSE:To improve mass productivity and long-term reliability, and to reduce the cost of the mounting of a lead by constituting an electrode of paste containing Cu or a Cu compound. CONSTITUTION:An n-type CdS sintered film 2 is formed onto a glass substrate 1, and a CdTe sintered film 3 is shaped onto the film 2. A carbon film 4 to which a proper quantity of an acceptor impurity is added is formed onto the CdTe film 3, and the acceptor impurity contained in the carbon film 4 is doped into the CdTe film 3 when the carbon film 4 is baked, thus shaping the p-type CdTe film 3. Consequently, a hetero-junction having a photovoltaic effect is formed between the N-type CdS sintered film 2 and the p-type sintered film 3. Paste in which Cu:Ag:Ni:epoxy resin binder are mixed at the weight mixing ratio of 50:20;18:12 is printed and applied onto the CdS sintered film 2 and the carbon film 4, and dried and cured for one hour at a temperature of 200 deg.C. The surface layer section of Cu particles is coated with Ag, Ni or a compound thereof. Leads are fitted to shaped electrode sections 5, 6 through soldering. It is most preferable that a soldering temperature is kept within the range of 200-250 deg.C. |
