发明名称 METHOD FOR BONDING PIEZOELECTRIC PLATE TO COVER PLATE
摘要 PURPOSE:To obtain a bonded section having high reliability by simple steps by coating a glass or ceramic plate with glass paste, heating to bake it to form a glass film, then superposing a piezoelectric plate thereon and bonding them by pressurizing and heating. CONSTITUTION:A cover plate is first coated by a screen printing method with glass paste, for example, in a thickness of approx. 5-30mum. The material, composition of the paste, the type and the viscosity of a binder are arbitrarily selected in response to the using purpose, and the material and the composition of the piezoelectric plate. After coating, it is heat-treated at the optimum vitrifying temperature determined by the material and the composition of the paste to form a glass film closely contacted rigidly with the glass plate. Then, the cover plate having the glass film is superposed on the piezoelectric plate, and bonded by pressurizing and heating. In this case, when the pressurizing force is 0.5-30kg/cm<2>, the heating temperature is set to 450-600 deg.C, and the holding time is set to a range of 10-90min; thus a bonding having high reliability is performed.
申请公布号 JPS63212555(A) 申请公布日期 1988.09.05
申请号 JP19860245983 申请日期 1986.10.16
申请人 FUJI ELECTRIC CO LTD 发明人 MATSUMOTO HIROZO;NAGAYAMA KAZUHIKO;SHIINA TOSHIE
分类号 B41J2/14;B41J2/16;C03C27/00;C04B37/00 主分类号 B41J2/14
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