SEMICONDUCTOR DEVICE WITH MOULDED PACKAGE

摘要

A semiconductor device with a package (15) moulded from plastics material includes a plurality of open-ended channels (17) which are spaced a predetermined distance from each other in the lower outer corner of the package at positions corresponding to those of a plurality of external leads (16). The external leads (16) are folded, with their tips (16b) positioned in the channels (17) and the middle portions (16a) of the external leads located above the base (18, 22, 22 min ) of the package so that a predetermined standoff distance (SO) is maintained between them.