| 摘要 |
PURPOSE:To increase the film forming, the heat-resisting and the dry-etching properties of the titled composition, and to improve the adhesion to a silicon wafer and the brittleness of the titled composition by incorporating a high mol.wt. novolak resin in the titled composition. CONSTITUTION:The titled composition contains the high mol.wt. novolak resin and 1,2-quinone diazide compd. The usable high mol.wt. novolak resin is produced by condensing phenol and formaldehyde in the presence of an acidic catalyst, such as hydrochloric acid, nitric acid, sulfuric acid, toluene sulfonic acid, and oxalic acid, etc. The usable 1,2-quinone diazide compd. is exemplified by 1,2-benzoquinone diazidosulfonic acid ester, etc. At the resin composition for forming pattern 1,2-quinone diazide compd. is photodecomposed by photoirradiating and by dipping the photodecomposed part of said compd. in a solvent, namely, a developer, the pattern is formed. |
