| 摘要 |
PURPOSE:To enable improvement in the package capacity to an aging board, by forming on a straight line contact pins which each comprise a contact head and a pin elastically supporting it to be arranged in a socket. CONSTITUTION:In a socket body 10 made of an insulating resin, contact pins 11 formed linearly are zoned and held at an equal space so as not to cause a short circuiting therebetween. The contact pins 11 each comprise a contact head 14 to be connected to a lead 13 of an IC 12 and a pin 15 for connection to an aging board or other external devices. The contact head 14 is made up of a conductor metal and the top thereof made broader to increase contact area with the lead 13. The bottom 14b thereof is inserted into the pin 15 formed into a bar and the contact head 14 is energized upward with a spring 16 inserted into the pin 15.
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