Method for measuring the solderability of through-plated holes in printed circuit boards, and a device for carrying out the method

摘要

In the case of a method for measuring the solderability of through-plated holes which are constructed in the form of hollow cylinders and are provided in holes in a printed circuit board and to which the liquid solder is passed from below, that time is measured at which the liquid solder which rises in the through-plated hole during the soldering process reaches approximately the upper end of the through-plated hole. An earth contact is allocated to each through-plated hole, a predetermined distance away on the underneath of the printed circuit board. The bottom of the printed circuit board is passed over a solder wave. At the same time, two times are recorded for each through-plated hole, during the soldering process. The first of these times is that at which the through-plated hole makes electrical contact with the earth contact associated with it, and the second of these times that at which the measurement probe associated with this through-plated hole also makes contact with the earth contact associated with it. <IMAGE>