HYBRID AND MULTI-LAYER CIRCUITRY

摘要

The present invention is directed to the process of forming a multi-layer 85 or hybrid circuit assembly 60. The assembly includes at least one ceramic substrate 12 having a deoxidized or oxygen free copper alloy foil 14 bonded thereto by a bonding glass 16. The copper alloy foil may be a circuit to which a resistive metal alloy tape 62 can be bonded so as to provide a path of precise resistance. Also, layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits 85,109,192.