发明名称 Method of and device for bonding two or more members.
摘要 <p>A stack of two members (4, 6) to be bonded, with or without an insert member (5) interposed therebetween, is pressed in the direction of the thickness thereof by a bonding device. An assembly of the stack and the bonding device (8) is heated to cause a difference in the thermal expansion between the materials of the members to be bonded and the bonding device so that the difference is utilized to produce bonding pressure and heat. A stable bonding is achieved only by controlling the magnitude of torque at which nuts of the bonding device are tightened, whereby fluctuation in the bonding strength and the thickness of a resultant product can be eliminated to assure a stable mass-production of composite articles.</p>
申请公布号 EP0280112(A1) 申请公布日期 1988.08.31
申请号 EP19880101895 申请日期 1988.02.09
申请人 HITACHI, LTD. 发明人 YOKOI, KAZUAKI;YAMADA, TOSHIHIRO;KOHNO, AKIOMI;HIOKI, SUSUMU
分类号 B23K20/00;B23K20/02;B23K20/16;C04B37/00;C04B37/02;(IPC1-7):C04B37/02 主分类号 B23K20/00
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