发明名称 |
Method of and device for bonding two or more members. |
摘要 |
<p>A stack of two members (4, 6) to be bonded, with or without an insert member (5) interposed therebetween, is pressed in the direction of the thickness thereof by a bonding device. An assembly of the stack and the bonding device (8) is heated to cause a difference in the thermal expansion between the materials of the members to be bonded and the bonding device so that the difference is utilized to produce bonding pressure and heat. A stable bonding is achieved only by controlling the magnitude of torque at which nuts of the bonding device are tightened, whereby fluctuation in the bonding strength and the thickness of a resultant product can be eliminated to assure a stable mass-production of composite articles.</p> |
申请公布号 |
EP0280112(A1) |
申请公布日期 |
1988.08.31 |
申请号 |
EP19880101895 |
申请日期 |
1988.02.09 |
申请人 |
HITACHI, LTD. |
发明人 |
YOKOI, KAZUAKI;YAMADA, TOSHIHIRO;KOHNO, AKIOMI;HIOKI, SUSUMU |
分类号 |
B23K20/00;B23K20/02;B23K20/16;C04B37/00;C04B37/02;(IPC1-7):C04B37/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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