| 摘要 |
PURPOSE:To inhibit the generation of voids, and to obtain a resin seal semiconductor having excellent moisture resistance and thermal shock resistance and high reliability by bringing the residual rate of air contained in a preform to specific percentage or less. CONSTITUTION:The residual rate of air included in a preform (hereinafter called a tablet) used for sealing is brought to 10% or less. Accordingly, when an IC, etc. are molded by a tablet, bulk density of which is increased by reducing air in the tablet, voids in products are decreased critically, thus improving both moisture resist ance and thermal shock resistance in the reliability of the IC.
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