| 摘要 |
<p>A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 g/l of copper sulfate as pentahydrate, from about 35 to about 90 g/l of sulfuric acid, from about 0.01 to about 1.0 g/l of a polyether surfactant having a molecular weight of from about 400 to about 10,000 from about 1 to about 100 mg/l of a sulfonated, sulfurized bezene brightener compound, and about 0.5 to about 5 mg/l of a grain refining compound having the nucleus <CHEM> in a heterocyclic ring structure, and a molecular weight between about 100 and about 180.</p> |
