摘要 |
PURPOSE:To obtain electric characteristics close to those of a final product and to discriminate an accurate propriety by providing a conductor which has a preset distance from upper surface of a semiconductor chip formed on a wafer and covers the chip, and applying a predetermined potential to the conductor to inspect it. CONSTITUTION:Element electrodes 21 of a semiconductor chip 2 formed on a wafer 1 and a plurality of probes 4 contacted with the electrodes, a probe card 3 for connecting the probes 4 to a test circuit, and a conductor plate 5 which is provided at a preset interval on the upper surface of the chip 2 and covers a predetermined range of the chip 2 to be connected to the test circuit are provided. A predetermined potential is applied to the plate 4 to measure the electric characteristics of the chip 2. Thus, electric characteristics near the final product of a resin-sealed semiconductor integrated circuit can be measured. An accurate propriety can be discriminated.
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