Thermal printhead integrated circuit device

摘要

An integrated circuit device having a lower layer electrode and an upper layer electrode disposed by way of an inter-layer insulation layer on an insulation substrate, wherein the pattern for disposing the lower layer electrode and the pattern for disposing the upper layer electrode are partially or entirely made substantially identical with each other. A method of manufacturing a thermal head for use in heat-sensitive recording wherein a glaze layer is disposed on an insulation substrate, a lower layer electrode of a common electrode is deposited thereover, over the lower layer electrode an insulation layer made of silicon nitride and/or silicon oxide is coated by way of plasma reaction coating and a heat generating layer and an upper layer electrode faced with a gap to individual electrodes are deposited.