发明名称 Nickel-phosphorus electroplating and bath therefor
摘要 An all chloride bath is provided for electroplating nickel phosphorus on a substrate. The bath includes 0.7-1.3 molar Ni+, 1-2 molar Cl-, and 1-3 molar HPO3+2. The bath also optionally contains 0.2-0.6 molar PO4-3. The bath contains as little sulfate as possible. Any sodium lauryl sulfate in the bath can be removed using a carbon filter. The electroplatings produced according to the invention have Knight shift, density, and non-uniform thickness properties more characteristic of electroplated nickel phosphorus than electroless. They have lower tensile strength, increased inherent brightness, and reduced graininess compared to electroplating from baths including sulfate. The bath has increased cathode efficiency, increased conductivity, and reduced formation of unwanted precipitates compared to baths with sulfates. The bath constituents may be provided from NiCl2.6H2O and H3PO3; or from Ni(H2PO3)2 and HCl.
申请公布号 US4767509(A) 申请公布日期 1988.08.30
申请号 US19870062641 申请日期 1987.06.16
申请人 BURLINGTON INDUSTRIES, INC. 发明人 GAMBLIN, RODGER L.;MYERS, NANCY E.;SUGG, DAVID J.
分类号 B41J2/16;C23F1/04;C25D3/56;(IPC1-7):C25D3/58 主分类号 B41J2/16
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